Ground Aluminum Hydroxide

Grinding aluminum hydroxide (chemical formula Al (OH)₃) is a high-purity white powder prepared by airflow crushing and classification technology, with a purity of ≥ 99.5% and an average particle size that can be accurately controlled between 0.5-10 μ m. Its core advantages are reflected in:

Particle size uniformity: Adopting nanoscale grinding technology, the particle size distribution is narrow (D90-D10 ≤ 3 μ m), meeting the strict requirements for powder consistency in high-end fields.

High wear resistance: Mohs hardness level of 3-3.5, achieving efficient cutting during polishing while avoiding substrate damage, suitable for precision materials such as optical glass and sapphire.

Chemical stability: Excellent acid and alkali resistance (stable at pH 3-11), does not react with organic compounds, adapts to multiple substrate systems such as resin and rubber, and expands application scenarios.

Ground Aluminum Hydroxide is used as environmentally-friendly halogen- free flame retardant additives in a wide variety of applications.Ground Aluminum Hydroxide Recommended to be used in plastics composites, conveyer belt, epoxy sealing and other rubber based compounds .as Aluminum Hydroxide factory in china , Shandong Taixing also produce several types Aluminium Hydroxide, including precipitated aluminum hydroxide, Low-viscosity Aluminum Hydroxide , these products can be used as flame retardant in plastic and rubber products . we supply high quality Aluminum Hydroxide with lower price and good service

Physical and Chemical Properties

General Properties

Application:Recommended to be used in plastics composites, conveyer belt, epoxy sealing and other rubber based compounds

1. Electronics and Semiconductors

Wafer polishing:

Nano sized ground aluminum hydroxide (D50=0.5 μ m) is used for CMP (chemical mechanical polishing) slurry, which can accurately control the copper/silicon surface removal rate (50-100nm/min), achieve global planarization, and adapt to processes below 14nm.

Electronic packaging materials:

Add 30-50% to epoxy resin to increase the thermal conductivity to 1.5W/(m · K), while reducing the coefficient of thermal expansion (CTE ≤ 10ppm/℃), suitable for 5G chip heat dissipation substrates.

2. Abrasives and ceramics

High end polishing solution:

Replacing cerium oxide in optical glass polishing improves grinding efficiency by 20% and reduces surface defect rate to ≤ 0.1/mm ², suitable for mobile phone cover glass and camera lenses.

Structural ceramics:

As a pore forming agent, adding 5-10% can generate Al ₂ O Ⅲ and release gas through high-temperature decomposition (above 300 ℃), which can regulate the porosity of ceramics (10-30%) and is suitable for filter elements and catalyst carriers.

3. Coatings and composite materials

Wear resistant coating:

Adding 20-30% to polyurethane coating can increase pencil hardness to 6H and wear resistance by 40%. It is suitable for surface protection of aerospace equipment and industrial flooring.

Polymer modification:

Adding 15-20% to nylon PA6 can increase bending strength by 15% and reduce friction coefficient to below 0.2, making it suitable for precision gears and bearing cages.

Packaging:Net weight 25kg/bag, Compound paper-plastic bag

Storage and Attention:Keep in dry, room temperature and moisture proof condition, preventing the heating

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